Sr. IC Packaging Project Manager - Flip Chip
Kforce Inc.

Job Info

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RESPONSIBILITIES:

Kforce's client, a growing engineering technology company in the Chandler, AZ area is seeking a Senior Electronics Packaging Engineer/Project Manager (Flip Chip). We are working directly with the hiring authority. This company offers a competitive base salary and annual bonus. Candidates must reside in the Phoenix, AZ metro area and/or be able to relocate to the Phoenix, AZ area. Our client will provide a relocation package. This position is hybrid remote. (2 days from home and 3 days in office).Responsibilities:

• Partner with teams to achieve annual goals, while managing customer relationships to grow market share
• Provide program management and internal process development in support of customers, offshore factories and supplier development teams while supporting qualification and mass production of flip chip products
• Promote company technologies directly to new and existing customers to find potential applications, deploying the flip chip package portfolio with key customers
• Work closely with customer teams to understand the assembly, reliability and scheduling requirements for various new package configurations and product introductions; To include: substrate design, silicon to package interconnects, product assembly material selections, etc.
• Create detailed package/process risk assessments for the manufacturability and reliability of NPIs, including highlighting areas of customer requirements that drive cost and implementing mitigation plans
• Work closely with customer package engineering and Company factory engineering to understand/characterize prototype build plans; Enabling successful qualifications and on-time manufacturing production ramps
• Assist the team in designing experiments, analyzing factory build data, root cause failure analysis investigation, and corrective action pathways to resolution

REQUIREMENTS:

• BS degree in Engineering such as Mechanical, Chemical, Electrical, Industrial, Materials Science or similar field
• 6-8+ years of demonstrated industry experience required, with semiconductor packaging experience required
• Familiarity with Design of Experiments (DoE) and Statistical Process Control (SPC) is needed
• Previous project management experience is a required
• Knowledge of material and package characterization data analysis, test methods and qualification procedures are required
• Strong understanding of wafer bump, assembly processes and techniques
• Proven ability to multiplex across numerous programs and teams is essential; Experience working with offshore factories is a plus
• Demonstrated self-drive and motivation to adapt and overcome obstacles across a multi-faceted, dynamic, and fast-paced environment; Ability to work independently in a heavily matrixed organization
• Requires excellent, demonstrated written and verbal communication skills
• Proficiency with Microsoft Office (Excel, PowerPoint, Outlook) is required
• This position can require up to 10% travel

Nice to haves:

• Experience with cost modeling, pricing, quoting activities and products is very beneficial
• Flip Chip package design and OSAT experience will be a plus
• Experience working with external customers is highly preferred

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